IC Packaging
Walton has built up a full range of IC package solutions, from legacy lead frame package type, to mainstream BGA package type. Working with global top semiconductor companies for more than 25 years, Walton has built up comprehensive engineering capability and manufacturing platform to fulfill customers' diversified product lineup and applications.
Lead frame Package
For IC products, such as NOR Flash, SLC NAND Flash and MCU, lead frame package type is still the dominant package type. Based on the lead layout design, we have dual and quad package family as below.
Dual
Quad
Wire Bond BGA Package
Wire bonding BGA is the mainstream package type, offering performance, small form factor at the same time. Walton has built up a grand scale of wire bond BGA package platform, providing best cost effectiveness.
MCP/SiP
Walton's MultiChip Package/ System-in-Package solutions help realize the goal of high density, high integration in a small form factor. Aside from JEDEC standard design, Walton is capable to provide customized package design service to fulfill customers' requirement in simplify PCB layout and supply chain management. Walton's expertise in wafer grinding, die bonding and wire bonding guarantees our capability to deliver the required quality, performance in appropriate form factor through MCP/SiP package design and manufacturing.